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3D Printing & The Future Of Intellectual Property Law (2014)

3D Printing & The Future Of Intellectual Property Law (2014)

 

2.0 MCLE Credits in Professional Practice

3D Printing is quickly changing the world. How will this exploding industry and these machines, which in theory can create anything, affect Intellectual Property?

In this presentation John Hornick, a recognized thought leader in the 3D printing space, will explore theintersection between 3D printing and intellectual property. 

 

Along with examples of advances in 3D printing and materials, John will address questions such as:

• How will the democratization of manufacturing affect IP?

• Can protection from infringement be balanced with the ability to innovate?

• Does IP stimulate or stifle innovation in the 3D Printing space?

• Is the existing IP regime up to the task, or is IP fundamentally in conflict with a 3D printed world?

• How is IP special in the 3D printing space?

• Who will win the tug of war between IP and open innovation?

• Will IP survive, or are we headed for a worldwide open technology community?
 

John Hornick is an IP counselor and litigator based in Finnegan’s Washington DC headquarters. Based on his 30+ years of experience, he counsels clients on virtually every aspect of IP law, from licensing to litigation. He has litigated close to 100 IP cases in more than 30 U.S. federal courts in 18 states, five U.S. circuit courts of appeals, the U.S. Supreme Court, the U.S. International Trade Commission (ITC), and others. He has appeared before more than 100 judges, arbitrators, and mediators and has tried every type of IP case. He has  successfully avoided litigation for clients in hundreds of other disputes. John started the firm’s 3D printing initiative and founded Finnegan’s 3D Printing Working Group.

Total Credits: 2.00 | Areas of Professional Practice: 2.00

Non-Member Pricing: $195.00
Published Date:
  • November 5, 2014
Format:
  • Online On-Demand
Product Code:
  • VDS14
Areas Of Professional Practice Credit(s):
  • 2.0
Total Credit(s):
  • 2.0